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Ball Grid Array Reballing How to ReBall BGA's
ReBalling Stencils BGA Spheres & Solder
Balls. Helpful Tips. |
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BGA
RE-BALLING QUALITY METHOD
This is the Original
"Zephyrtronics Way" of Re-Balling Used Globally. |
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HOW TO: |
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Reballing Ball Grid Arrays is easy, but
quality is paramount. Here are ten simples
steps! Note: We interchange the words
"stencil" and "screen" here as they are both
used in the industry. |
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1. Apply a thin film of a
very tack, no clean flux (Zephlux™
(NCF-0014
) over entire grid area of the BGA package using an
anti-static foam swab
as shown at left. Our tack flux "holds" your chip in position
with the stencil (next step). |
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2. Match the
appropriate re-balling screen for your BGA pattern. Place your
component (with the tack flux applied as shown above) onto
the underside of your reballing screen/stencil. Make sure your
component and the stencil are squared. Do NOT use liquid (runny)
fluxes or paste fluxes (stringy).
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3.
Ideally, position a "Re-Balling Pan"
under the Stencil. Place chip into
Re-Balling Pan so that the handles of
stencil lay directly above those of the
Re-Balling Pan as shown at left. Note how
well the "tack" flux holds chip and stencil
together! |
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4.
Pour appropriate Solder Spheres onto
Re-Balling Screen. Securing both handles of
the stencil, rotate left & right dumping any
excess spheres into the Tank. If your
stencils don't have handles, you can secure
the stencil with your Kapton®
tape or other ways easily enough. |
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5.
Next up: the
ZT-3 Air Pick™
with a Re-Balling Needle Tip (from our
popular
ZT-5-VPAK variety tip pack) to hold your
Solder Spheres onto the end of the AirPick™.
The AirPick™
features the unique "quick vacuum release"
critical when trying to get the job done. |
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6.
Now, use your ZT-3-AirPick™
to remove any extra, loose and "rolling
around" Solder Spheres from out of the
stencil. Also use your AirPick to fill in
any holes on your Re-Balling Screen as shown
here. The Zephyrtronics way of using a tank
is helpful as it catches all the extra
solder spheres. |
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A Good BGA Re-Balling Set-Up or Station Should Include All of
the Following:
• Solder Spheres for Re-Balling
Vial of 10K -30
Mil Diameter
Vial of 10K -25 Mil Diameter
Vial of 10K -20 Mil Diameter
Vial of 10K -12 Mil
Diameter
• Re-Balling Stencil/Screen (BGA Pattern)
•
Re-Balling Pan, • Re-Balling Platform
• Re-Balling Tank (If
possible)
• Re-Balling
Needle Tip
Pack (ZT-5-VPAK)
•The
ZT-1
AirBath™ Bottom-side Preheat
•
LowMelt® DeSolder
Wire 487
•
AirPick™
Vacuum Lifting System
• Zephlux™
Tacky Flux
• Non-Flammable
Flux Remover
• Scrub
Brushes
•
Foam Swabs,
ESD Safe
&
Solder Wick
• Set of Two Stainless Steel
Tweezers
Be Sure You Verify if You are Working With Tin/Lead or Lead-Free
Alloys.
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7.
Place the Re-Balling Platform (out of VO
non-flammable glass fiber board) into your
ABC-1 Board Cradle™.
Position the the Cradle in front of your
ZT-7-MIL. Now,
simply place the Re-Balling Pan and Re-Balling Screen on top
of the ReBalling Platform.
Using a
Zephyrtronics AirBath™ from below,
preheat your chip (very important) at this stage. Remember,
a BGA is essentially a very small and delicate PCB so
preheat is really needed! |
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8.
After a 1-2 minute preheat (soak) of the chip
and spheres, you can next lower the Z-axis heating zone of
the ZT-7-MIL down to where the hot air nozzle is
approximately 1/8" or 3mm above the Re-Balling unit. Set
your countdown timer to 1:20 to 1:30 for most chips. Set
your top temperature to 230ºC to 250°C for most chips. Start
the timer and the heating from above. |
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9.
Yes! The picture at the left says it all. When the timer
begins to beep, turn off top heater. As the Re-Balling unit
cools, carefully separate the component out from the screen
as shown in the photograph at the left. (Caution: The
Re-Balling unit may still be hot.) Inspect your component
and you are ready for final cleaning. |
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10.
Final Cleaning: Dip one of your
Scrub Brushes
into the
non-flammable
flux remover (NFR-0056, also included in the Kit!).
Generously apply the flux-remover throughout the component
until all of the old flux has been stripped away. Inspect.
Note: If you are re-using the same
BGA, but need to remove the old solder, use the ZT-1 AirBath™
together with our famous
LowMelt® DeSolder
Wire. Oh, yeah. Ideal application. |
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Ten Easy to Follow Steps for
High Quality Re-Balling!
We've made it easy for you!
Don't be shy! Give us
a call or e-mail us today
at
david@zeph.com
with any
questions. We are always happy to assist
you. |
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©1996 - 2011, 2012, 2013-2017, 2018, 2019, 2020 by Zephyrtronics®. All rights reserved.
The information, text, images, photographs, charts, graphs you
receive online from Zephyrtronics® are protected by the
copyright laws of the United States. The copyright laws prohibit
any copying, redistributing, retransmitting, or repurposing of
any copyright-protected material. Zephyrtronics is the
registered trademark property of JTI, Inc. "The Science of
Zephyrtronics" and "Simplicity Through Innovation" and "Zephlux"
and "ZeroLead" and "Zero Balling" and "Zero Residue" and "Post
Cooling" and "Post Cooler" and "AirBath" and "SolderGlide" and
"SolderMill" and "Just So Superior" are the protected trademark
property of JTI, Inc. "Zephyrtronics" and "Low Melt" and "Air
Fountain" and "Fountainhead" are the registered trademark
properties of JTI Inc. *The above names are the registered
property of their respective owners. |
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