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All Zephyrtronics Equipment is Engineered and Manufactured in the United States of America.
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XBox 360 Ring of Death Repair: Your Solution for BGA, SMT & CSP Rework, Reflow, Repair & Reballing Made Easy for You
XBOX 360 REPAIR SYSTEMS
ZEPHYRTRONICS ZT-7 PROFESSIONAL HOT AIR REFLOW CENTER
Soldering and De-Soldering the GPU, CPU & the Samsung "Memory Chip".
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Red rings? Error codes? Ring of Death? Repairing
the
Xbox 360 printed
circuit board (PCB) is easier than ever with
the
ZT-7 Hot Air
Soldering Benchtop System.
Easy for reflowing (re-soldering) chips, or de-soldering and removing
a
GPU, CPU or Memory Chip, and replacing and
re-soldering them back to the PCB. The ZT-7
System is affordable, has 15 years of proven
performance, is made in the U.S. with a 2-year
limited warranty.
Don't be fooled by IR systems that may
"repair" a PCB temporarily, but actually harm boards and chips.
Complete reflow of the entire solder ball on each connection
is required, not only "tangential reflow" that later
reopens as the PCB flexes during console play.
Video
Comparisons & Demonstrations: 4 Methods of
Preheating & Solder Reflow
illustrates the advantages of forced
convection and why it's the global PCB industry
standard worldwide.
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PCB Fixtures Must Be Independent
from both the lower pre-heater and from the upper
reflow heater.
If one is
trying to repair or reflow a large quantity of
PCB's, then speed is important. So having to wait
for a large PCB (like the XBox 360) to first
preheat, and then later to cool down for a long time
before moving on to the next PCB wastes a lot of
time and money and profit.
An
Independent PCB Holding Fixture is
simply essential for reworking PCB. Save
time and money. Learn why:
Video: The ABC's of PCB
Holding Fixtures.
And don't
overlook the fact that the ZT-7 is equally effective for
PlayStation®
PCB Repair & Rework Station.
Not Just
for Game Consoles, your ZT-7 is also
a moneymaker
if you are repairing smartphones,
tablets, laptops and most every type of
PCB on earth! |
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Understanding the GPU, CPU, Memory Chips
and Ball Grid Arrays (BGA's):
Q: What are
these chip packages that Microsoft®
and Sony®
call the GPU, the CPU, and the Memory
Chips? And why do they look so different
from other components?
A: These are electronic chips that are
packaged in what are called Ball Grid
Array formats (BGA's). They are a
relatively new form of Surface Mount
Devices (SMD) and are similar to other
components in that they have an
integrated circuit (die) within the
package and that they have connections
to be soldered. However, instead of
leads at the side of the chip, the
connections are balls underneath the
chip (See Below):
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Above left: Bottom side of a QFP Surface
Mount Chip with the leads at the side
for soldering to the PCB.
Above right: Bottom side of a BGA Chip with solder spheres
(balls) at the bottom for soldering to
the PCB.
Many chips on the XBOX 360®
and PlayStation®
PC Boards are packaged in
the BGA format including the
GPU, CPU and Memory Chips. Indeed, most
consumer electronic PCB's today
incorporate more and more BGA style
chips as they are more robust in
construction and have faster gate speed
for processing.
Once a BGA is placed and soldered to the
PCB, you can no longer "see" any
connections (balls): they are underneath
the chip and not visible to the eye.
The XBOX and PlayStation®
PCB's chips are all soldered with
lead-free solder, not the more
traditional solder. Lead-free solder
requires higher than traditional
temperatures so PCB preheat
imperative.
Good News! BGA's are
easy to remove and replace
with the right gear and proper
procedures. Zephyrtronics has built
into the popular ZT-7 so many
great features including effective
preheating for those lead-free solder
joints |
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At the
left, you can see the XBOX 360 printed circuit board
populated with its components including the critical
GPU, CPU and Memory Chip chips. And shown below is
the XBOX CPU component which is Ball Grid Array
(BGA) styled package (see the yellow highlighted
sidebar for further explanation). |
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XBox 360 GPU BGA |
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Effective PCB pre-heating is critically
important for success and quality
soldering and rework of XBox 360
chips and boards. And this is where many
systems "repair stations" fail miserably
because of their ineffective IR preheating
under the PCB thus requiring
unacceptable higher final soldering
temperatures above which permanently
damage the chips. And once a chip is
damaged, it then has to be completely
removed, replaced and re-soldered. |
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Beware! Some "repair stations"
have such ineffective upper heaters that they require the entire PCB
to be pre-heated
underneath to over 200°C for over twenty minutes! Worse, the manufacturers
of these "machines" advise users to cover chips with foil during the
process. Are they crazy? This nonsense is prohibited by reputable PCB labs
and repair companies. |
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BGA's have less metal content than old
traditional chips and components with leads.
These chips
are far more sensitive to high temperatures.
A low temperature (150°C) preheat around 3 minutes is required before
any rework, soldering or desoldering is to
be made.
BGA's have technical data sheets with strict temperature limitations
to prevent
damaging them while soldering. |
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ZT-7 Benchtop System |
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The
ZT-7 is the
very same soldering system that was used by
NASA to place and solder the critical,
high-reliability I.C.'s on the two Mars
Rovers whose mission was so successful in
2003 and 2004.
Good enough for NASA and easy enough to
repair an XBox 360 PCB! And at a great
price! Click here to learn more detail about
the
ZT-7 Hot Air Station. |
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Helpful Rework Guide:
Zephyrtronics ships each ZT-7 with a
detailed and helpful owners manual along
with the 39-page report by NASA for its
employees which features approximately 300
photographs filled with technical tips and
techniques. In addition, for those reworking
and repairing XBox360®
modules, we also include a
step-by-step illustrated guide for removing
and replacing the components and even
practice PC Boards and chips!
A
Warning from NASA About IR Rework
Systems:
"Hot
plates and infrared pre-heaters are not
recommended...The reason that they
should not be used is that the thermal
reaction times, energy transfer rates and
efficiency are never consistent."
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The ZT-7 Has
No IR
whatsoever, only the decades proven
"industry standard" of forced convection hot
air. The
ZT-7 is
easy to operate with digital,
closed-loop, programmable
temp control, digital countdown
timing, bottom-side preheat and thermal
profiling for quality work.
The ZT-7 is not limited to just
the XBox PCB's, but is ideal for
reworking smart-phones, laptops, plasma television PCB's,
prototype and small production runs.
For more specs, technical
info and product details about
our popular XBox®
or PlayStation®
repair stations, click for the full
webpage for the
ZT-7 Hot Air BGA & SMT
PCB Center.
Or call us at our Los Angeles
factory Mon-Fri 8-6PM (Pacific) at
(909) 865-2595 or e-mail
david@zeph.com. We're
happy to help.
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ZT-7-XBOX REWORK COMPREHENSIVE SYSTEM
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Description
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Item |
Price |
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The ZT-7-XBOX Comprehensive System
BGA & SMT Hot Air Bench Top Reflow System
Includes:
The ZT-7-MIL BGA & SMD Hot Air Repair Center (shown above)
Plus
The ZT-1-BGS-DPU BigGrid™ AirBath Preheating System
The ABC-1 Adjustable Board Cradle
The ZLK-XBOX Benchtop Supply Kit
Note: The ZLK-XBOX Kit Includes the ZeroFlex™ PC Board Brace
Plus All of the Following XBox Hot Air Nozzles:
ZT-7-3021 (31 X 31MM), ZT-7-3007 (35 X 35MM),
ZT-7-3082 (11 X 14MM) and ZT-7-3005 (23 X 23MM)
Plus All the Essential XBox Repair Supplies & Tools
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ZT-7-MIL
ZT-1-BGS-DPU
ABC-1
ZLK-XBOX
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$6,010
LIMITED
TIME
OFFER!
$5,575
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The ZT-7-XBOX-ZF Comprehensive System BGA & SMT
Hot Air Bench Top Reflow System
Includes:
The ZT-7-MIL BGA & SMD Hot Air Repair Center (shown above)
Plus
The ZT-1-BGS-DPU BigGrid™ AirBath Preheating System
The ABC-XYZ Adjustable Board Cradle
The ZLK-XBOX Benchtop Supply Kit
Note: The ZLK-XBOX Kit Includes the ZeroFlex™ PC Board Template
Plus All of the Following XBox Hot Air Nozzles:
ZT-7-3021 (31 X 31MM), ZT-7-3007 (35 X 35MM),
ZT-7-3082 (11 X 14MM) and ZT-7-3005 (23 X 23MM)
Plus All the Essential XBox Repair Supplies & Tools
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ZT-7-MIL
ZT-1-BGS-DPU
ABC-XYZ
ZLK-XBOX
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$6,510
LIMITED
TIME
OFFER!
$5,995
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XBOX Zero Flex Template
Thick, Machined Metal Plate With Reciprocal Studs for PCB Holes
Thick Metal Plate Prevents PC Board Flexing During Rework
Openings Permit PCB Quicker & More Uniform Preheat From Below
Works With ABC-XYZ Board Cradle
(Note: ZeroFlex™ Template is Included In ZLK-XBOX Kit)
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ZT-7-ZF-XB |
$150
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©1996 - 2011, 2012,
2013, 2014-2016, 2017, 2018, 2019,
2020 - 2022
by Zephyrtronics®. All rights reserved.
The information, text, images, photographs, charts, graphs you
receive online from Zephyrtronics® are protected by the
copyright laws of the United States. The copyright laws prohibit
any copying, redistributing, retransmitting, or repurposing of
any copyright-protected material. Zephyrtronics is the
registered trademark property of JTI, Inc. "The Science of
Zephyrtronics" and "Simplicity Through Innovation" and "Zephlux"
and "ZeroLead" and "Zero Balling" and "Zero Residue" and "Post
Cooling" and "Post Cooler" and "AirBath" and "SolderGlide" and
"SolderMill" and "Just So Superior" are the protected trademark
property of JTI, Inc. "Zephyrtronics" and "Low Melt" and "Air
Fountain" and "Fountainhead" are the registered trademark
properties of JTI Inc. *The above names are the registered
property of their respective owners. |
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CLICK HERE to
Go Directly to Our Easy-to-Navigate and Illustrated Product Directory. |
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SMD
Rework,
SMT Rework
AirBath Air Bath,
SMD Rework Stations,
Hot Air Pencil Soldering,
BGA Rework Stations,
CSP Rework Stations,
Preheating Systems,
PCB Preheaters,
Pre-Heat SMT/ SMD,
Low Temp Rework,
SMT DeSoldering Tools,
Vacuum Pickup Tools,
Circuit Board Holders,
PCB Fixture & PCB Holders
&,
Board Cradles,
Rework Solder Paste,
No-Clean Solder Paste,
Low Melt®
De-Solder Wire,
DeSolder Wire,
Hot Air Rework Stations,
Fume Extractors,
SMT Dental Probes,
SMT, SMD Rework Kit,
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LMK Kit,
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SMD Tweezers,
Power Palm Plunger,
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How
To - SMT, CSP, BGA Rework
How To - BGA Alignment;
How To - SMT Rework;
How To - PCB Preheating,
How To - BGA & CSP Rework;
How To - Quickly Solder
SMD Packages Effectively;
How To - CSP Alignment;
How To - Lead-Free Rework;
How To - SMD Removal
Economical;
How To - SMD Removal
Professional;
How To - Hot Air Pencil /
AirPencil Soldering;
How To - SMD Quick Chip
Removal;
How To - BGA Re-Balling;
How To - Rework PLCC, QFP,
QFN, LCC, SOIC, SOL, Shielded SMD, TSOP;
How To - Solder & Rework
Ceramic Capacitors;
How To - Solder & Rework
Glass Diodes;
How to Repair Smartphones,
Tablets and Laptops
Soldering,
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Smoke Extractors,
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SolderMill™,
Solder Sucker / DeSolder
Pump,
Pre-heating Systems,
Preheat Thru-Hole,
PCB Pre-heaters,
Flux Solvent,
How To - Connector Rework;
How To - PC/104 Soldering
and Rework;
How To - Thru-Hole /
Through Hole Desolder / De-Solder;
How To - Low Melt®
Desolder Wire;
How To- Stop Lifting Pads;
How To- Desolder /
De-Solder Heavy Ground Planes;
How To - Lead-Free
Soldering and De-Soldering;
Pre-Heaters for Lead-Free Rework and Soldering
Dispensing Equipment, Gear, Supplies, Dispensing
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Sponges,
Iron Plated Soldering Tips,
Foam Swabs,
Anti-Static Foam Swabs,
Thru-Hole & Solvent
Brushes,
Helping Hands,
LMK Rework Kits,
X-BOX 360 Repair,
Wire Strippers & Wire
Cutters,
Flush Cutters, Micro
Shears & Needle Nose Piers,
Straightening Tool for
QFP Leads,
ESD Wrist Straps,
ESD Wrist Strap Tester
Updated
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