TM   STEP 1: First, insert the patented & trademark Alignment Cube into corresponding, non-heated nozzle.  Next, activate the ZT-7’s vacuum to secure Cube within  nozzle as shown.

STEP 2: Lower “Z” Axis of ZT-7 To Where Alignment Cube Hovers Directly Over (NASA Recommends About 1mm Above) the Targeted BGA Pads on the PCB Below.

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STEP 3: Moving the Adjustable Board Cradle (PCB fixture), next “Align the PCB’s pads for the targeted BGA to the Alignment Tool by adjusting the ABC-1 Circuit Board Cradle as necessary.”
--  NASA '04.  Photo Courtesy of NASA

STEP 4B: NASA explains the alignment simplicity this way: “The alignment process is completed when the solder pads are just hidden on all directions. The drawing (above) shows what a properly aligned 5 x 5 BGA would look like. The solder pads (red) are just contained the Alignment Tool outline (blue).”-- NASA, '04. Illustration courtesy of NASA from NASA Report describing the Zephyrtronics patented BGA alignment template and methodology.

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STEP 4A: Square & Mate the Cube to Outside Perimeter of BGA Pads. The Nozzle’s X, Y and Theta are Now Precisely Relationed to Targeted Pads! Cube Temporarily “Holds Place” for the BGA. Raise “Z” Axis, Deactivate Vacuum Releasing Cube. The next helpful illustration expands on the alignment concept a bit more.

STEP 5: Insert Your BGA/CSP into the Now-Aligned Nozzle Where the Cube Had Been. Activate Vacuum to secure BGA. Lower “Z” Axis and Nozzle Down to the Substrate. Release Vacuum. Your BGA is Positioned on to Corresponding Pads! You are now ready to reflow your BGA with your Zephyrtronics ZT-7 System. How easy is that?

STEP 1: BGA removal requires cleanup as unequal solder deposits will still remain at vacated site. After chip removal, slide the “Y” Axis of ZT-7 back out of way, and apply flux to pads. Begin preheat to the bottom of the PCB at 150°C with the AirBath™.

STEP 2 (OPTION “A”): After briefly preheating (soaking) your PCB and generously applying flux, use a heated DeSoldering Tool with a “soft tip-pad interface” and suck up excessive solder from your pads. Preheating permits lower, safer temps for all DeSoldering tasks.

STEP 2 (OPTION “B”): A  popular method is to generously apply flux and melt LowMelt® DeSolder into the residual solder on the pads with the AirBath™. Remove all solder with a foam swab or Solder Sucker

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STEP 3:  Switch off the ZT-7 and the AirBath. Gently clean site with a foam swab and a Non-Flammable Flux Remover. Inspect. (Notice? No Wick!)